We integrate proven OEM technology into fast-charging wired and wireless solutions and specialize in providing today’s Warfighters with ruggedized products designed to operate in the most austere environments. Because our capabilities range from wireless fast charging solutions to compact bulk charging, our technology represents cutting edge solutions that can be directly integrated into defense applications.


  • Wireless Power and Data Transfer
  • Fast Charging
  • Silicon Carbide (SiC) Semiconductor ICs
  • Wireless Charging Over Distance
  • Fiber Optics Cable
  • Solid State Power Bank


  • Rapid Charge Wireless Pad
  • Smart Charging Hub
  • Wall and Vehicle Chargers
  • Round, Flat and Braided Cabling
  • Fast Charging Power Banks
  • Rugged Phone Case
  • Bulk Charging


  • Mechanical and Electrical Engineering
  • 80,000 Square-Foot Facility
  • R&D Test Lab
  • Pre-Compliance Testing for USB-C PD and Qi Certification
  • Accelerated Life Testing
  • Industrial Design
  • Rapid Prototyping


One of the most distinguishing characteristics is our drive to collaborate with customers and partners to deliver fast charging power solutions rapidly. We develop rugged, high quality power solutions for the Soldier – meeting the widely varied requirements for the U.S. Military.


More than 100 years of senior leadership expertise in engineering design, development and manufacturing.


A privately-held, financially stable company with more than 30 years of business experience. 80,000 square-foot facility with ample room for growth.


Superior power-to-weight performance. Holder of 12 patents.


In-House Testing Capabilities and Accreditation
  • Strategic partnership with Granite River Labs, Xentris Wireless is an extension lab for compliance testing
    • Allows for quick certification of PD/QC chargers
    • First to receive information on new PD IC/chip solutions that have been certified
    • Early notification of changes in USB PD and charging behavior in mobile devices
  • Our lab provides compliance testing for the following technologies:
    • Apple MFi: Lightning
    • Qualcomm Quick Charge (QC): 2.0/3.0/4+
    • USB-IF: USB Power Delivery (PD) 2.0/3.0
    • WPC: Qi
  • Temperature/Humidity Chamber
  • X-Ray Machine
In-House Engineering Capabilities
  • Electrical, Mechanical and Industrial Engineering
  • MIL-STD-810H and MIL-STD-461G
  • Advanced Concept Development
  • Turnkey In-House Design Capabilities
  • In-House PCBA Design
  • In-House Prototyping Capabilities (3D Printing)
  • SolidWorks (Mechanical)
  • Altium Designer (Electrical)
In-House Manufacturing Capabilities
  • Assembly
  • Electronics Manufacturing
  • PCB Assembly
  • Ultrasonic Welding
  • Testing